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Soracom, a global IoT platform provider with full MVNO capability, has announced the commercial launch of its integrated SIM technology (iSIM) and an iSIM-compatible cellular module built on the Murata Type 1SC.
This offering marks Soracom’s third SIM format, complementing its card-type SIMs and chip-type eSIMs, all of which provide access to Soracom’s best-in-class cellular IoT connectivity platform.
The commercial launch of iSIM technologies has been in development since July 2021, made possible through key partnerships with IoT chipset developer Sony Semiconductor Israel, Ltd., iSIM module manufacturer Murata, and iSIM Security solutions provider Kigen. Kigen’s Secure iSIM Operating System ensures robust secure authentication services for reliable out-of-the-box connectivity in commercial iSIM applications.
iSIM technology integrates the functions of the communication module and SIM into a single chip (System-on-Chip or SoC). This enables IoT device manufacturers to create more compact, lightweight, and power-efficient devices, as fewer physical components are required. Designing connected devices with this integrated solution reduces procurement, logistics, and storage costs, while also lowering the environmental impact across the device lifecycle.
The “Type 1SC” module from Murata Manufacturing Co., Ltd. comes pre-installed with Soracom’s plan01s subscription, allowing users to connect seamlessly to cellular networks worldwide. Utilizing Soracom’s subscription container feature, these modules can also access other data plans, such as the optimized LPWAN planX3. Additionally, users gain access to Soracom’s suite of connectivity tools, including data and device security, remote provisioning services, and cloud integration.
Soracom also offers an evaluation board kit for customers interested in testing iSIM integration before committing to full deployment. This iSIM EVK can handle NTN-IoT services as well as GNSS.
Dima Feldman, VP of Product Management and Marketing, Sony Semiconductor Israel Ltd.
We would like to express our gratitude to our partners for this exciting collaboration. Through this innovative model, iSIM seamlessly connects the LPWA chipset to the Soracom network, simplifying the hardware design and onboarding experience for our customers. This approach is essential for driving the adoption of lower-power cellular IoT applications and we believe it will significantly enhance IoT device-makers engagement and satisfaction.
Hirokazu Nakae, General Manager, Connectivity Module Product Department, Communication Module Business Unit, Murata Manufacturing Co. Ltd.
As an ultra-compact, low-power iSIM-compatible cellular LPWA communication module, our Type 1SC module is a perfect fit for Soracom users. Combining our miniaturization technology with iSIM provides users with a quick and easy solution for deploying IoT services at scale.
Vincent Korstanje, CEO of Kigen
Thanks to our longstanding partnership with Soracom and our ecosystem partners, IoT device manufacturers now have instant access to our iSIM solution, accelerating developers’ speed to market and enhancing their ability to leverage global connectivity. This is a major milestone in supporting manufacturers with iSIM commercial general availability, globally.
Ray Sharma is an Industry Analyst and Editor at The Fast Mode. He has over 15 years of experience in mobile broadband technologies and solutions, conducting research and analysis on various technology segments and producing articles and write-ups on the latest developments within the sector. He is also in charge of social media engagement and industry liaisons.
Follow him on LinkedIn or Facebook. He can be reached at ray.sharma@thefastmode.com
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